Phoenix – Production Atomic Layer Deposition System

1. Overview

• The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing.
• Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike.
• And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs.
• A compact footprint and innovative design make the Phoenix® the practical choice for those with batch production ALD requirements.

2. Key features include:

• Precise software control of process parameters, including temperature, flow, and pressure, for defect-free coatings on even the most sensitive substrates
• Patented ALD Shield™ vapor trap to prevent the build-up of deposits and minimizes excess process gases from being exhausted into the environment
• Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes, and larger 3D objects
• Low cost of ownership with minimal startup and operational costs
• Compact footprint that conserves valuable cleanroom space
• Standard recipes and ALD materials readily available
• Comprehensive support and services worldwide from the technical team and PhD scientists
• CE, FCC, and CSA compliant with many built-in safety features

3. Technical specifications